Tape Out Engineer - Integrated Photonics (ID 2403)

LIGENTEC is a fast-growing European company with headquarter in Lausanne, Switzerland. Since 2021 we expanded our manufacturing capabilities by creating LIGENTEC France, in the South of Paris. We specialize in the design & manufacturing of Photonic Integrated Circuits (PICs) for customers in high-tech areas such as Quantum Technologies, LiDAR, Space Technologies, and Biosensors. LIGENTEC All-Nitride (AN) technology enables our customers to develop their products in the Industrial Revolution 4.0. You are about to enter this unique opportunity to bring R&D to product. To support our continued growth, we are looking for a: Customer Tape Out Engineer - Integrated Photonics Tasks Client Design Interface: Engage directly with client design teams to thoroughly understand their chip designs, advising on design for manufacturability (DFM) to ensure optimal compatibility with our fabrication processes. Design Verification and Optimization: Perform comprehensive checks on client photonic integrated circuit (PIC) layouts, ensuring conformity with our foundry's design rules and manufacturability criteria, and suggest necessary optimizations. Data Preparation for Manufacturing: Accurately prepare and validate client design data for the mask-making process, ensuring all elements are correctly formatted and aligned with our foundry's capabilities. Comprehensive Design Rule Checking (DRC): Execute thorough DRC processes to identify and resolve layout violations, collaborating with clients to ensure designs are optimised for our manufacturing environment. Layout vs. Schematic (LVS) Accuracy: Ensure the physical layout precisely matches the client's schematic designs, making adjustments as needed to meet our stringent standards. Executing the Final Tape-Out Process: Lead the final tape-out process, meticulously preparing and validating all design files, ensuring they are production-ready, and submitting them for manufacturing within the agreed timelines. Process Enhancement: Actively contribute to the enhancement of DFM guidelines, tape-out procedures, and client interaction protocols to continuously improve efficiency, manufacturability, and client satisfaction. Requirements Bachelor’s or Master’s degree in Electrical Engineering, Physics, Materials Science, or a related technical field Experience in the semiconductor industry, particularly in tape-out roles within a foundry environment, demonstrating a deep understanding of the tape-out process and its criticality in chip manufacturing Proficiency with EDA tools used in mask data preparation, preference on Mentor, Synopsys Experience with scripting languages (e.g., Python) for automation and process efficiency Knowledge of semiconductor manufacturing processes, especially photolithography Excellent communication and interpersonal abilities, capable of effectively collaborating with both clients and internal teams. Attention to detail and commitment to achieving high-quality outcomes. Excellent problem-solving skills, with the ability to identify, analyse, and resolve complex technical issues. Photonics experience is a strong plus Ability to work in a team and independently. Benefits A flexible and dynamic start-up work environment A highly international, diverse and highly motivated team Personal responsibility in your job and the chance to grow with us Our passion to bring PICs to everyday life. We look forward to receiving your full application including 1) your CV, 2) a statement of interest (relating the position to your skills) and 3) grade or work certificates. Non-complete applications may not be considered. #J-18808-Ljbffr